On August 27, at Technoprom 2024, an agreement was signed between Novosibirsk State Technical University (NETI) and Planar Open Joint Stock Company (Minsk, Belarus). The subject of the agreement is long-term cooperation between the parties on the supply of technological equipment and its components on mutually beneficial terms.
The agreement was signed by Anatoly Bataev, Rector of NSTU-NETI, and Sergey Avakov, General Director of Planar Open Joint Stock Company. The parties agreed on the joint development of the technological base for the production of highly efficient on-board energy-converting equipment with a microprocessor control system based on microelectronic technologies.
"Our task is to move forward all the time in terms of technology development, development and manufacture of new prototypes of modern products. The uniqueness of the agreement lies in the fact that under the conditions of global sanctions, using the potential of our Belarusian colleagues, we continue to develop technological capabilities. By and large, this is, to one degree or another, import substitution of equipment units in demand in power electronics," commented Anatoly Bataev, Rector of NSTU-NETI.
Within the framework of the agreements provided for in the agreement, the parties will jointly develop technological equipment and technology for the production of high-level power hybrid integrated circuits using Flip-Chip technology (2.5/3D) and produce prototypes of the specified equipment.
As noted by the director of the Institute of Power Electronics, Head of the Department of Electronics and Electrical Engineering of NSTU-NETI, Doctor of Technical Sciences, Professor Sergey Kharitonov, there are still no manufacturers of equipment for the development of hybrid integrated circuits in the country, which implement the so-called Flip-Chip technologies. "Together with Planar, we will form a technical specification for this equipment, develop and test it. Next, we will work out the technology of manufacturing equipment and bring it to mass production. Thanks to the long-term cooperation with Planar, we will be the first in the country to receive domestic Flip-Chip technology equipment. It will definitely be a breakthrough for us."
The parties agreed to coordinate and sign the first list of domestic (Russian-Belarusian) equipment recommended for development in 2025-2035 for the production of highly efficient on-board energy-converting equipment with a microprocessor control system using 3D technology and 2.5D assembly no later than December 31, 2024.